序号 | 测试项目 | 缩写 | 样品数/批 | 批数 | 测试方法 |
1 | Pre- and Post-Stress Electrical and Photometric Test | TEST | 所有应力试验前后均进行测试 | 用户规范 | |
2 | Pre-conditioning | PC | SMD产品在WHTOL、TC、PTC试验前预处理 | JESD22-A113 | |
3 | External Visual | EV | 每项试验前后均进行测试,除DPA和尺寸测试 | JESD22-B101 | |
4 | Parametric Verification | PV | 25 | 3 Note A | 用户规范 |
5a | High Temperature Operating Life | HTOL1 | 26 | 3 Note B | JESD22-A108 |
5b | High Temperature Operating Life | HTOL2 | 26 | 3 Note B | JESD22-A108 |
5c | High Temperature Reverse Bias | HTRB | 26 | 3 Note B | JESD22-A108 |
6a | Wet High Temperature Operating Life | WHTOL1 | 26 | 3 Note B | JESD22-A101 |
6b | Wet High Temperature Operating Life | WHTOL2 | 26 | 3 Note B | JESD22-A101 |
6c | High Humidity High Temperature Reverse Bias | H3TRB | 26 | 3 Note B | JESD22-A101 |
7 | Temperature Cycling | TC | 26 | 3 Note B | JESD22-A104 |
8a | Power Temperature Cycling | PTC | 26 | 3 Note B | JESD22-A105 |
8b | Intermittent Operational Life | IOL | 26 | 3 Note B | MIL-STD-750-1 Method 1037 |
9 | Low Temperature Operating Life | LTOL | 26 | 3 Note B | JESD22-A108 |
10a | Electrostatic Discharge Human Body Model | HBM | 10 | 3 | JS-001 |
10b | Electrostatic Discharge Charged Device Model | CDM | 10 | 3 | AEC Q101-005 |
11 | Destructive Physical Analysis | DPA | 2/试验 | 1 | Appendix 6 |
12 | Physical Dimension | PD | 10 | 3 | JESD22-B100 |
13 | Terminal Strength | TS | 10 | 3 | MIL-STD-750-2 Method 2036 |
14 | Constant Acceleration | CA | 10 | 3 | MIL-STD-750-2 Method 2006 |
15 | Vibration Variable Frequency | VVF | JEDEC JESD22-B103 | ||
16 | Mechanical Shock | MS | JEDEC JESD22-B104 | ||
17 | Hermeticity | HER | JESD22-A109 | ||
18a | Resistance to Solder Heat | RSH (-reflow) | 10 | 3 | 含铅:JESD22-A113、J-STD-020 |
无铅:AEC-Q005 | |||||
18b | Resistance to Solder Heat | RSH (-wave) | 10 | 3 | 含铅:JESD22-B106 |
无铅:AEC-Q005 | |||||
19 | Solderability | SD | 10 | 3 | 含铅:J-STD-002、JESD22-B102 |
无铅:AEC-Q005 | |||||
20 | Pulsed Operating Life | PLT | 26 | 3 | JESD22-A108 |
21 | Dew | DEW | 26 | 3 | JESD22-A100 |
22 | Hydrogen Sulphide | H2S | 26 | 3 | IEC 60068-2-43 |
23 | Flowing Mixed Gas | FMG | 26 | 3 | IEC 60068-2-60 Test method 4 |
24 | Thermal Resistance | TR | 10 | 1 | JESD51-50、JESD51-51、JESD51-52 |
25 | Wire Bond Pull | WBP | 10 | 3 | MIL-STD-750-2 Method 2037 |
26 | Wire Bond Shear | WBS | 10 | 3 | AEC Q101-003 |
27 | Die Shear | DS | 5 | 3 | MIL-STD-750-2 Method 2017 |
28 | Whister Growth | WG | / | / | AEC Q005 |